- All sections
- B - Performing operations; transporting
- B23K - Soldering or unsoldering; welding; cladding or plating by soldering or welding; cutting by applying heat locally, e.g. flame cutting; working by laser beam
- B23K 1/015 - Vapour-condensation soldering
Patent holdings for IPC class B23K 1/015
Total number of patents in this class: 30
10-year publication summary
0
|
2
|
1
|
4
|
1
|
3
|
4
|
3
|
4
|
4
|
2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
Owner |
All patents
|
This class
|
---|---|---|
Samsung Electronics Co., Ltd. | 131630 |
3 |
3m Innovative Properties Company | 18406 |
3 |
Panasonic Intellectual Property Management Co., Ltd. | 27812 |
3 |
Yield Engineering Systems, Inc. | 15 |
3 |
Yield Engineering SPV LLC | 27 |
3 |
International Business Machines Corporation | 60644 |
1 |
Mitsubishi Electric Corporation | 43934 |
1 |
Tyco Electronics Corporation | 792 |
1 |
Diamond Innovations, Inc. | 241 |
1 |
ERSA GmbH | 92 |
1 |
Kne Kabushiki Kaisha | 2 |
1 |
Picosun Oy | 130 |
1 |
Rolls-Royce Corporation | 1686 |
1 |
Senju Metal Industry Co., Ltd. | 654 |
1 |
SS Techno, Inc. | 1 |
1 |
Werkzeugbau Siegfried Hofmann GmbH | 16 |
1 |
GE Infrastructure Technology, LLC | 5873 |
1 |
Endress+Hauser SE+Co. KG | 428 |
1 |
Siegfried Hofmann GmbH | 20 |
1 |
Leicht, EVA | 1 |
1 |
Other owners | 0 |